TTEP 2008 - Call for Tutorial Proposals

CALL FOR TUTORIAL PROPOSALS

Overview -- Author Information -- Tutorials and Education Group

Overview

The Tutorials & Education Group (TEG) of the IEEE Computer Society Test Technology Technical Council (TTTC) organizes in 2008 a comprehensive set of Test Technology Tutorials to be held in conjunction with TTTC sponsored technical meetings. The objective of this common call is to invite submissions for tutorial proposals in order to enable selecting the best fitted tutorials for each technical meeting, as part of the annual Test Technology Educational Program (TTEP).

The tutorials accepted by the Program Committee will be included in the Test Technology Educational Program, the intent of which is to serve the test and design professionals offering fundamental education and expert knowledge in state-of-the-art test technology topics.

Participation in TTEP-organized tutorials is credited by IEEE Computer Society. Each full day tutorial corresponds to four TTEP units. Upon completion of each sixteen units official accreditation in the form of the “IEEE TTTC Test Technology Certificate” is presented to the participants.

The TTEP 2008 tutorials program includes (but is not limited to) the following technical meetings:

Latin American Test Workshop (LATW’08), February 17–20, Puebla, Mexico
Design Automation & Test in Europe Conference (DATE’08), March 10–14, Munich, Germany
VLSI Test Symposium (VTS’08), May 4–8, San Diego, California, USA
Signal Propagation on Interconnects Workshop (SPI’08), May 12–15, Avignon, France
International Conference on Automation, Quality&Testing, Robotics (AQTR’08), May 22-25, Cluj-Napoca, Romania
European Test Symposium (ETS’08), May 25–29, Lago Maggiore, Italy
International On-Line Testing Symposium (IOLTS’08), July 6–9, San Sebastian, Spain
International Test Conference (ITC’08), October 26–30, Santa Clara, California, USA
Asian Test Symposium (ATS’08), November 24–27, Sapporo, Japan

TTEP accommodates a wide range of technical areas, from mature test topics of high interest to industrial test engineers to emerging test topics with emphasis on novelty. TTEP is soliciting new and updated tutorial proposals and the topics of interest for year 2008 TTEP Tutorials include (but are not limited to):

Automatic test equipment
Board-level testing
Built-In Self-Test
Defect oriented testing
Design for testability
DFT testers
Diagnosis and debug
Embedded core testing
High-speed interface testing
Interconnect characterization
Memory testing
Mixed-Signal/Analog testing
Nanometer techn. testing
On-line and field testing
Performance/Delay testing
Power issues in testing
System-level testing
Test economics
Test synthesis
Test resource partitioning
Validation
Verification
Wafer testing
Yield optimization and test

Author Information

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All tutorial proposal submissions to TTEP 2008 are to be made electronically through the TTEP submissions website: http://cad.cs.unipi.gr/~ttep

Deadlines and key dates:

October 5, 2007: Deadline for DATE08 proposals.
November 16, 2007: Deadline for all other TTEP08 events.
November 10, 2007: Notification of acceptance for DATE08.
February 25, 2008: Notification of acceptance for the other TTEP08 events.

Contact Information:

Dimitris Gizopoulos
TTEP Chair
University of Piraeus, Greece
T: +30 210 414 2372
F: +30 210 414 2264
E: dgizop@unipi.gr

Anand Raghunathan
TTEP Vice Chair
NEC Labs USA
T: +1 609 951 2967
F: +1 609 951 2499
E: anand@nec-labs.com

Kaushik Roy
TTEP Vice Chair
Purdue University, USA
T: +1 765 494-2361
F: +1 765 494-3371
E: kaushik@ecn.purdue.edu

TTEP central web site:http://tab.computer.org/tttc/teg/ttep
TTEP web site for submissions: http://cad.cs.unipi.gr/~ttep

Tutorials and Education Group

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Chair
Dimitris Gizopoulos
University of Piraeus

Vice Chair (Organization)
Anand Raghunathan
NEC Labs

Vice Chair (Program)
Kaushik Roy
Purdue University

Planning
V. Agrawal, Auburn University
G. Robinson

Communications
M. Hsiao, Virginia Tech.

Industry Relations
R. Aitken, ARM

Finance
M. Nicolaidis, TIMA Laboratory

Initiatives – New Topics
B. Courtois,TIMA Laboratory

Publicity
C. Metra, University of Bologna
Y. Makris, Yale University

Audio/Visual
S. Menon, Intel

Electronic Media
G. Xenoulis, U. of Piraeus

Organizing Liaisons
U.Arz, PTB
J.Figueras, UPC
I.Ghosh, Fujitsu
M.Inoue, NAIST
L.Miclea, TU Cluj-Napoca
R.Murphy, INAOE
M.Psarakis, U. Piraeus
J.Segura, U. Illes Balears
L.Thiele, ETH Zurich

Program Committee
T.Aikyo, STARC
R.Aitken, ARM
D.Appello, ST Microelectronics
U.Arz, PTB
S.Bhunia, Case West. U.
K.Butler, Texas Instruments
S.Chakravarty, LSI Logic
V.Champac, INAOE
S.Davidson, Sun
J.Figueras, UPC
A.Gattiker, IBM
P.Harrod, ARM
K.Hatayama, STARC
M.Inoue, NAIST
D.Josephson, Intel
T.M.Mak, Intel
H.Manhaeve, Q-Star
L.Miclea, TU Cluj-Napoca
A.Osseiran, Edith Cowan U.
A.Paschalis, U. of Athens
B.Paul, Toshiba
A.Raghunathan, NEC Labs
G.Roberts, McGill U.
S.Sunter, LogicVision
L.Thiele, ETH Zurich
N.Touba, U. Texas at Austin
B.West, Credence
D.Wheater, IBM

For more information, visit us on the web at: http://tab.computer.org/tttc/teg/ttep

The Test Technology Educational Program 2008 (TTEP 2008) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).

TTTC's Electronic Broadcasting Service
	TTEP 2008 TEST TECHNOLOGY EDUCATIONAL PROGRAM 2008 http://tab.computer.org/tttc/teg/ttep